MIL-M- 50747( MU)
8 August 1973
3.1 Fabrication, The MALF 3 Buffer Logic, herein referred
to as the assembly, shall be manufactured in accordance with Drawing
F11738803 and drawings pertaining thereto.
3,2 General specification. The assembly shall meet the
following requirements, where applicable, of MIL-F-13926:
a. Order of precedence
b. Dimensions and tolerances
c. Part identification and marking
d. Electrical and electronic assemblies
e. Part identification and marking
3. 2.1 Soldering. Soldering shall be in accordance with MIL-S-
45743 or MIL-S-46844, except that bare copper wire exposure shall he
perrnitted at clipped ends of component leads.
3.3 Performance. Unless otherwise specified, the assembly
Shall meet the performance requirements of this specification at standard
ambient temperatures between 60 degrees Fahrenheit ( F) and 90 F.
3. 3.1 Loads, power, and signals. The assembly shall perform
as specified herein when the loads, power, and signals of table I are
applied as specified.
3. 3.1.1 Reset signal. With the type-B signal (item 3, 3 of table
1) applied to P1-10 as shown in figure 1, the output at P1-29 and P1-30
shall be as shown in figure 1. (These signals may be recurring.)