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| MIL-M-63320A(AR)
Functional
operations. When the device is connected as
3.5.3
shown in Figure 4 and the waveforms shown in Figures 5 thru 14 are
a p p l i e d to terminals 1, 2 , 10, 11, 13 and 15; operation shall be as
by the output waveforms at terminals 3, 4, 5, 6, 7, and 9
described
in Figures 5 thru 14 when tested as specified in 4.15.14.
Oscillator
function. ( P i n s 12, 13, 14). The device
3.5.4
s h a l l function as an oscillator with the following output periods at
pin 5:
( a ) When the temperature varies over the operating range
( - 4 5 C to 85C) and the voltage varies from 3.5 to 4.5 volts,
the output period shall not shift more than 5% from the period at
(b) When the temperature varies over the operating range
(-45C to +85C) and the voltage varies from 5 to 7.5 volts, the
o u t p u t period shall not shift more than 5% from the period at
2 5 C and V D D= 6.2 volts.
(c) The output period at pin 5 shall be 173 35 millisecond @
2 5 C and V DD = 7.0 volts.
T h e s e requirements shall be tested for as specified in 4.5.15.
3,5,5 Reset pins/bond pads. T h e reset line on the microcircuit
shall be accessible to external signals via dual bond pads, with
each bond pad connected to its own package pin (pins 10, 11). When
t e s t e d as specified in 4.5.16, the maximum resistance between pins
10 and 11 shall be 10K OHMS.
3 . 5 . 6 S c r e e n i n g . A l l devices to be delivered in accordance
w i t h this specification shall have been subjected to the screening
procedures as specified in MIL-STD-883 Method 5004 for a class B
d e v i c e , and as specified herein (see 4.4.2.1).
3 . 5 . 6 . 1 B u r n - i n . T h e devices shall be subjected to the burn-in
test as specified in MIL-STD-883 Method 5004 and 4.5.17 herein.
3 . 5 . 7 S t e a d y s t a t e l i f e . T h e devices shall be subjected to the
steady state life test of MLL-STD-883 Method 1005 condition D and
4 . 5 . 1 8 herein.
3 . 6 Device marking. The device shall be marked with the
i n t o x m a t i o n specified in 3.6.1 thru 3.6.5, and the primary markings
( i n d e x point, part number, and inspection lot identification code)
s h a l l be located on the top surface of the package. The other
markings may be placed in any suitable location so as to perform
t h e i r functions and not interfere with the primary markings.
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