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|  MIL-P-46067B(MR)
6.
NOTES
6.1 Intended use. The epoxy embedding compounds are intended for use in
encasing coils, capacitors and the like, or in assemblies of electrical
components or for forming small structural details of an electrical
insulating nature.
6.1.1 Composition 1. Composition 1 is used in applications where low
viscosity is a special advantage.
6.1.2 Composition 2. Composition 2 is used in preference to Composition
1 when a lower cure shrinkage, a coefficient of thermal expansion closer
to that of the ordinary metals, and a higher thermal conductivity are
desired.
6.1.3 Composition 3. Composition 3 is used for the same applications as
Composition 2 as their properties are identical, except for color.
6.2
Ordering data.
Procurement documents should specify the following:
a.
Title, number and date of this specification.
b.
Composition required (see 1.2).
c.
Weight per epoxy equivalent, if a specific value or range
is required
d.
Property values for shrinkage, dielectric strength, dielectric
constant, and volume resistivity (see (3.2.1).
e.
Minimum pot life (see 3.5).
f.
Level of preservation and packing required (see 5.1, and 5.2).
g.
Quantity of cans, pails or drums required, as applicable
(see 5.1.1).
h.
Whether palletizing is required (see 5.2.1, and 5.2.2).
i.
Any special marking required (see 5.3).
6.3 Preparation of compositions . The embedding compounds may be prepared
according to the following formulas:
Ingredient
Parts by weight
Comp. 1
Comp. 2
Comp. 3
Epoxy resin
100
100
100
Filler
-
125
125
White paste
-
2
-
Black paste
-
-
2
Hardener
20-25
20-25
20-25
12
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