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Page Title:
Circuit board assembly test procedure |
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|  MIL-P-70624A(AR)
4.5.1.6 Trans portation vibration. The Power Box Components
Assembly shall be conditioned in accordance with MIL-STD-810, Method
514.3, Category 8, Test Procedure I, Figure 514.3-7 thru 514.3-9
(500 miles) and Figure 514.3-10 thru 514.3-22 (50 miles). The power
box components assemblies shall be tested after conditioning and as
specified in 4.5.1.1 and 4.5.1.2.
(First Article Only)
4.5.2 Printed circuit board assembly (Dwg. 9360006) test
procedure.
4.5.2.1 Board power.
Pin
Voltage
C
131
21.5 .5
P
A, L
0 (GND)
4.5.2.2 Circuit board assembly test procedure.
a. With power OFF, solder a lead temporarily to the plated
through hole on the PC board land going to pin 1 of U108 and mark
the lead "U108-1".
b.
Set the signal generator at 1000 HZ sinewave 10V P-P.
c.
Connect positive lead of multimeter to lead "U108-1".
d. Apply board power per Para. 4.5. 2.1, and on Pin Z apply
the 1000HZ 10V P-P Sinewave.
e. The voltage of U108-1 should be less than 0.10V. If
not, adjust potentiometer R147 to reach this condition.
f. Turn the potentiometer R147 until the voltage on U108-1
first exceeds 0.2V. The voltage should be between 0.2 and 2.0 volts.
g.
If the voltage is greater than 2.0V, repeat steps e and
f.
h. Slowly increase the frequency of the sinewave until the
voltage of U108-1 just rises above 6.5 volts. The frequency should
be between 1440 and 1450 HZ.
i. Connect the positive lead of the multimeter to pin B.
The meter should read between 5.30 and 5.50 volts. Turn power and
signal generator off.
4.5.2.3 Circuit board assembly test procedure.
Connect printed
wiring board in accordance with Figure 3.
80
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