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|  MIL-P-70624A(AR)
4.5.4.15 Cold tempe rature (-25F -5F). The electronics
box shall be conditioned in accordance with MIL-STD-810, Method
502.1, Table 502.2-1, Basic Cold (Cl) Procedures II. The
electronics box shall be tested immediately after conditioning as
specified in 4.5.4.
4.5.4.16 Hot tempe rature (12F +5F). The electronics
box shall be conditioned in accordance with MIL-STD-810, Method
501.2 Table 501.2-111, Hot (Al) Procedure II. The electronics box
shall be tested immediately after conditioning as specified in 4.5.4.
4.5.4.17 Transpo rtation vibration. The electronics box shall
be conditioned in accordance with MIL-STD-810, Method 514.3,
Category 8, Test Procedure I, Figure 514.3-7 thru 514.3-9 (500
miles) and Figure 514.3-10 thru 514.3-22 (50 miles). The
electronics box shall be tested after conditioning as specified in
4.5.4.
4.5.5 Protective finish. The contractor shall prepare test
panels of the same material as used in the component, at the time of
finishing the components or assemblies, subjected to the same
finishing process, and shall submit the test panels for the tests
specified in MIL-C-46168, para. 3.6.6, 3.6.7, 3.6.8, 3.6.10, 3.6.11
and 3.6.14. .
PACKAGING (See 6.3)
5.
5.1 Preservation and packing.
5.1.1 Level A. All of the components included in this
specification shall be packaged in accordance with Level A of the
corresponding Packaging Data Sheets.
5.1.2 Level B.
Same as Level A above.
5.1.3 Level C. Each component shall be packed in accordance
with commercial requirements of ASTM-D-3951 with the following
mandatory requirements. All items shall be packed individually in a
fiberboard box with cushioning as required. The fiberboard box
shall be sealed in a barrier bag conforming to Type 1, Class F of
Specification MIL-B-117. Note: Cable must not be kinked or bent
excessively. Unit pack quantity shall be "Each".
5.2 Packing.
5.2.1 Level A. All of the components shall be packed as
specified in the corresponding Packaging Data Sheet.
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