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|  MIL-R-23016(Wep)
Electrical Connections:
3.1.23.2
Joints shall be mechanically secure before soldering. No con-
nection shall depend on soft solder alone for mechanical strength,
except in the case of small parts where mechanically secure con-
nections are impractical, such as in eyelets, connector solder
caps, etc. (see 3.1.35.2).
Solder:
3.1.23.3
Only compositions Ag 1.5, Ag 2.5, Sn-70, Sn-60, Sn-50, and Sb-5
solder conforming to Specification QQ-S-571 shall be used. Type
AC flux shall not be used.
Springs:
3.1.24
3.1.24.1
Contact Springs:
Beryllium-copper, beryllium-cobalt-copper, chromium-coppers
palladium-copper, silver-copper, platinum-iridium, phosphor-
bronze, or nickel-silver, tempered and plated as necessary,
shall be used for contact springs. Endurance limits and elec-
trical conductivity of the springs shall not be adversely
affected by corrosion, fatigue, high operating temperature, or
other adverse phenomena resulting from service conditions enu-
merated herein.
3.1.24.2
Tempering:
Springs of beryllium-copper alloys shall be heat-treated to the
proper spring temper after forming. Springs made from materials
which are not heat-treatable shall have the direction of grain
within 45 of the linear length of the spring.
Switches:
3.1.25
A-F Switches:
3.1.25.1
Plastic materials used in the construction of a-f switches shall
conform to the requirements of 3.1.15.
RF switches:
3.1.25.2
The preferred switch for use in r-f circuits is one utilizing
ceramic insulation. Plastic materials used in r-f switches be
type PBE in accordance with Specification MIL-P-3115.
37
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