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|  MIL-R-23016(Wep)
(a) Subassemblies using printed circuits, upon which the
parts are printed or mechanically placed and soldered.
(b) Construction in which several ceramic or filled plastic
wafers are placed one above the other and components
printed or mounted thereon.
(c) Three-dimensional, or folded-type construction, in
which the parts are mechanically placed and soldered.
3.2.1.7
In order to permit flexibility in the arrangement or assembly
of modules and subassemblies, interconnecting leads involving
circuits considered susceptible of radiated interference or
capable of radiating interference should be shielded and of
low-impedance design. All other connections (such as power)
should be well shielded or bypassed internally to prevent
radiation or pickup of extraneous fields.
3.2.1.8
Quality connectors shall be used to connect the subassembly
to the chassis or next order assembly. Pressure contacts
shall not be used to connect detail parts to printed or other
type wiring. The connectors to be used shall be submitted
for approval as nonstandard parts.
3.2.2
General:
The detailed mechanical and electrical design of the equip-
ment shall be accomplished by the contractor, subject to the
requirements of this specification.
The requirements of this specification
are detailed only to the extent considered necessary to obtain
the desired mechanical and electrical characteristics, per-
formance, and permanence of the same. The design layout and
assembly of the units and their component parts shall be such
as to facilitate quantity production and to result in minimum
size and weight.
Fabrication:
3.2.2.1
Boxes, cases, shields, and compartment walls shall be made by
casting, drawing, or bending, and welding, except when ease of
servicing of the equipment requires that a removable panel con-
struction be used, or when the applied stresses dictate the use
of a strong aluminum alloy which does not provide a good weld;
for such parts, riveting or bolting may be used.
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