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Thermal shock (high and low temperature operation) |
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|  MIL-R-83407B
3.5 Solderability (applicable to solder terminals). When relays are tested as specified in 4.5.2, the dipped surface
of solid wire-lead and pin terminals shall be at least 95 percent covered with a continuous new solder coating in
accordance with method 208 of MIL-STD-202.
3.6 Dielectric withstanding voltage. When relays are tested as specified in 4.5.3, they shall withstand the
specified voltage (see 3.1) without damage. The leakage current shall not exceed 1 milliampere (mA) and there
shall be no evidence of damage due to arcing (air discharge), flashover (surface discharge), or insulation breakdown
(puncture discharge).
3.7 Insulation resistance. When relays are tested as specified in 4.5.4, the insulation resistance shall be as
specified (see 3.1).
3.8 DC coil resistance. When relays are tested as specified in 4.5.5, the dc coil resistance shall be as specified
(see 3.1).
3.9 Pickup and dropout voltage. When relays are tested as specified in 4.5.6, the pickup and dropout voltage
shall be as specified (see 3.1).
3.10 Coil power dissipation (when specified) (see 3.1). When relays are tested as specified in 4.5.7, the power
dissipated shall be as specified (see 3.1).
3.11 Contact resistance. When relays are tested as specified in 4.5.8, the contact resistance of any pair of mated
contacts shall not exceed the specified value (see 3.1).
3.12 Operate and release time. When relays are tested as specified in 4.5.9, the operate and release time shall
be as specified (see 3.1).
3.13 Coil inductance (when specified) (see 3.1). When relays are tested as specified in 4.5.10, the coil
inductance shall be as specified (see 3.1).
3.14 Contact noise (when specified) (see 3.1). Relays shall be tested as specified in 4.5.11. The peak to peak
ratings for the bandwidth (dc to 10 kilohertz (kHz)) shall be 400 microvolts (V) at closure, 200 V at 1.5 milliseconds
(ms), 125 V at 2 ms, 60 V at 2.5 ms, 35 V at 3 ms, 15 V at 4 ms, and 10 V at 5 ms.
3.15 Thermal EMF (when specified) (see 3.1). When relays are tested as specified in 4.5.12, the thermal EMF
shall be as specified (see 3.1).
3.16 Capacitance (when specified) (see 3.1). When relays are tested as specified in 4.5.13, the capacitance shall
be as specified (see 3.1).
3.17 Thermal shock (high and low temperature operation). When relays are tested as specified in 4.5.14, they
shall meet the following requirements at each temperature extreme.
Insulation resistance - - - - - - - - - - -
As specified in 3.7. At high temperature, insulation resistance
between coil and enclosure shall be 500 megohms (mΩ) minimum.
Pickup and dropout voltage - - - - - -
As specified in 3.9.
Operate and release time - - - - - - -
As specified in 3.12.
Visual examination - - - - - - - - - - - -
No cracking, peeling, or flaking of the finish is allowed.
Following this test, dielectric withstanding voltage shall be as specified in 3.6.
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