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|  MIL-S-19819C(OS)
3.5.1.3 Vibration; transportation. The firing switch, after being sub-
jected to the tests specified in 4.3.1.3, shall show no damage and shall
meet all the performance requirements and product characteristics of this
specification.
3.5.2 Shock
3.5.2.1 Shock; ready condition. The firing switch, self-mounted on a
shock testing device as specified in 4.3.2.1, shall be capable of with-
standing a shock of 150g peak magnitude, of not less than 8 ms pulse dura-
tion, and approximating a one-half sine wave pulse. Thereafter, the switch
shall show no damage and shall be capable of meeting all the performance
requirements and product characteristics of this specification.
3.5.2.2 Shock; transportation, storage, and handling. The firing switch,
after being subjected to the test specified in 4.3.2.2, shall show no damage
and shall meet all the performance requirements and product characteristics
of this specification.
3.5.3 Acceleration.
The firing switch, mounted securely on an accelera-
tion device as specified in 4.3.3, shall be capable of withstanding an ac-
celeration of 15g's applied for not less than 0.2 second. Thereafter, the
switch shall show no damage and shall be capable of meeting all the perform-
ance requirements and product characteristics of this specification.
3.5.4 Temperature and humidity
3.5.4.1 Transportation and storage condition. The firing switch, packaged
and packed as defined in Section 5, shall be capable of withstanding trans-
portation and storage temperatures and humidities between minus 65 degrees F
and plus 160 degrees F for a period of 28 days, as specified in 4.3.4.1.
Thereafter, the switch, less pack or packaging, shall show no corrosion or
damage and shall be capable of meeting all the performance requirements and
product characteristics of this specification.
3.5.4.2 High and low temperature operation. The firing switch, less pack
and packaging and mounted as specified in 4.3.4.2, shall be capable of with-
standing temperatures over the range of minus 40 degrees F to plus 130 degrees F,
as specified in 4.3.4.2. At the conclusion of the test, and while still at
the test temperature, the switch shall show no corrosion or damage and shall
be capable of meeting all the performance requirements and product character-
istics of this specification.
3.6 Cleanup. Prior to and after final assembly, all components shall be
thoroughly cleaned of loose, spattered, or excess solder, metal chips, and
other foreign matter.
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