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Design, construction, and physical dimensions. |
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|  MIL-M-38510/650B
2. APPLICABLE DOCUMENTS
2.1 Government documents.
2.1.1 Specifications and standards. The following specifications and standards form a part of this document to
the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of
the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation (see 6.2).
SPECIFICATIONS
DEPARTMENT OF DEFENSE
MIL-PRF-38535
- Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard for Microelectronics.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
(Copies of these documents are available from the Standardization Document Order Desk, 700 Robbins Avenue,
Building 4D, Philadelphia, PA 19111-5094 or http://astimage.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil.)
2.2 Order of precedence. In the event of a conflict between the text of this specification and the references cited
herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws
and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before
contract award (see 4.3 and 6.4). This specification has been modified to allow the manufacturer to use the
alternate die/fabrication requirements of paragraph A.3.2.2 of MIL-PRF-38535 or other alternative approved by the
qualifying activity.
3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as
specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the
QM plan shall not affect the form, fit, or function as described herein.
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be
as specified in MIL-PRF-38535 and herein.
3.3.1 Logic diagrams and terminal connections. The logic diagrams and terminal connections shall be as
specified on figure 1.
3.3.2 Truth tables and logic equations. The truth tables and logic equations shall be as specified on figure 2.
3.3.3 Schematic circuits. The schematic circuits shall be maintained by the manufactuer and made available to
the qualifying activity or preparing activity upon request
3.3.4 Case outlines. The case outlines shall be as specified in 1.2.3 and MIL-STD-1835.
3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).
3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table I,
and apply over the full recommended ambient operating temperature range, unless otherwise specified.
3.6 Electrical test requirements. The electrical test requirements for each device class shall be the subgroups
specified in table II. The electrical tests for each subgroup are described in table III.
3
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