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| ![]() MIL-C-50736(MU)
8 August 1973
3.0
REQUIREMENTS
3.1 Fabrication. The circuit assembly, herein referred to as
the assembly, shall be manufactured in accordance with Drawing F11737350
and drawings pertaining thereto.
3.2 General specification. The assembly shall meet the following
requirements, where applicable of MIL-F-13926:
a.
Order of precedence
b.
Dimensions and tolerances
c.
Part identification and marking
d.
Electrical and electronic assemblies
e.
Workmanship.
3.2.1 Soldering. Soldering shall be in accordance with
MIL-S-45743 or MIL-S-46844, except that bare copper wire exposure
shall be permitted at clipped ends of component leads.
3.3 Perormance. Unless otherwise specified, the assembly
shall meet the performance requirements of this specification at 0
standard ambient temperatures between 60 degrees Fahrenheit ( F)
and 90F.
3.3.1 Power and signals. The assembly shall perform as
specified herein when the power and signals of table I are applied as specified.
TABLE I
POWER AND SIGNALS
3
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