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|  MIL-C-70498(AR)
0.5F per foot in any direction. The heat source of the test
chamber shall be so located that radient heat, if used, will not
fall directly on the test item. Theromocouples or equivalent
temperature sensors utilized to determine or control the specified
chamber temperature shall be centrally located within the test
chamber within the supply airstream, or in the return airstream,
whichever provides the specified test condition at the item under
test and shall be baffled or otherwise protected against radiation
effects.
4.5.2.3.2 Fabrication, setup and calibration. Design and
fabrication of test equipment shall be such that it incorporates
the features of rigidity, stability, and ease of maintenance.
Setup and calibration equipment necessary for certification of the
testing equipment accuracy shall be furnished and will become a
part of the testing equipment. Operating and calibration
instruction shall be prepared and submitted to the procuring
activity.
Unless otherwise specified
4.6 Test methods and procedures.
in the contract, the following procedures shall be utilized to
conduct specified tests. If the contractor chooses to use
alternate test procedures, a detailed description of the set-up
and procedure shall be submitted to the government procuring
agency for approval prior to use.
4.6.1 ESS temperature. Testing equipment utilized in this
test shall conform to the requirements of 4.5.2.3.1. The
interconnect shall be placed in the test chamber and the
temperature of the chamber reduced 10oC (180F) per minute plus
or minus 1C (1.8oE') from room ambient temperature (as
specified in 3.3.1) to -57C (-71F). The interconnect shall
be maintained at this temperature for a minimum of 20 minutes.
Upon completion of the 20 minute exposure, the temperature of the
chamber shall be raised 100C (18F) per minute plus or minus
1C (1.8F) to +71F (+160C). The interconnect shall
remain at this temperature for a minimum of 20 minutes. Upon
completion of the 20 minute exposure the temperature of the
chamber shall be reduced 10C (180F) per minute plus or minus
10C (1.80F) to room ambient temperature (as specified in
3.3.1). The above procedure shall be conducted a minimum of ten
times. Upon completion of the cycles the interconnect shall then
be removed from the chamber and subjected to the test in 4.6.3.
It shall meet the requirements of 3.2.1.
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