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|  MIL-E-63124B(AR)
4.4.3 Testinq
4.4.3.1 Functioning. Each electronics module, after compliance
The test shall be
with 4.5.7, shall be subjected to this test.
performed as specified in 4.5.1 using equipment in accordance with
4.4.4. If any unit fails to comply with the requirements of 3.3, it
shall be classified defective and removed from the lot.
4.4.3.2 High temperature. Each electronics module submitted
for first article testing shall be subjected to functioning at high
temperature. The test shall be performed after Humidity testing
(see 4.4.3.6) as specified in 4.5.2 using equipment in accordance
with 4.4.4. If any unit fails to comply with the requirements of
3.4.4, the first article sample shall be rejected.
Each electronics module submitted
4.4.3.3 Low temperature.
for first article shall be subjected to functioning at low
temperature. The test shall be performed as specified in 4.5.3
using equipment in accordance with 4.4.4. If any unit fails to
comply with the requirements of 3.4.5, the first article sample
shall be rejected.
4.4.3.4 Helicopter vibration. Each electronics module
submitted for first article testing shall be subjected to this
test. The test shall be performed as specified in 4.5.4 using
equipment in accordance with 4.4.4. If any unit fails to comply
with the requirements of 3.4.1, the first article sample shall be
rejected.
4.4.3.5 Transportation vibration. Each electronics module
submitted for first article testing shall be subjected to this
test. The test shall be performed as specified in 4.5.5 using
equipment in accordance with 4.4.4. If any unit fails to comply
with the requirements of 3.4.2, the first article sample shall be
rejected.
4.4.3.6 Humidity Each electronics module submitted for first
article testing shall be subjected to this test. The test shall be
performed as specified in 4.5.6 using equipment in accordance with
4.4.4. If any unit fails to comply with the requirements of 3.4.3
the first article sample shall be rejected. Following this test,
the electronics assembly shall be subjected to functioning at high
and low temperature (See 4.4.3.2 and 4.4.3.3).
4.4.3.7 Soldering. Each electronics module shall be inspected
for soldering in accordance with 3.5. If any wiring or printed
circuit card assembly fails to comply with the requirements of 3.5,
the unit shall be classified defective and removed from the lot.
4.4.3.8 Seal integrity. (Dwg. 9311429) This test shall be
performed as specified in 4.5.8. If any unit fails to comply with
the requirements of 3.6, it shall be classed defective and removed
from the lot.
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