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|  MIL-E-63124B(AR)
4.4.4 Inspection equipment. The inspection equipment required
to perform the inspections and tests prescribed in this
specification is identified in the "Paragraph Reference/Inspection
Method" column of the tables starting with paragraph 4.4.2.1, and
the test method paragraphs (see 4.5). The contractor shall submit
for approval, inspection equipment designs in accordance with the
terms of the contract. See Section 6 of MIL-A-48078, and section
6.3 herein.
4.5 Methods of inspection.
4.5.1 Functioning. Each Electronic Module shall be subjected
to testing utilizing the functioning test system, and procedure
described in Dwg. 9280369. The dispenser, excluding those
conditioned at high or low temperature, shall be conditioned for
four (4) hours minimum at 25 5C (ambient). Observation shall
be made for compliance with the applicable requirements.
(Non-Destructive Test)
After conditioning at 54 2C
4.5.2 Hiqh temperature.
according to MIL-STD-810C, Test Method 501.1, the electronics module
shall be subjected to the functioning test of 4.5.1 at high
temperature. Observation shall be made for compliance with the
applicable requirements. (Non-Destructive Test)
4.5.3 Low temperature. - After conditioning at -54 2C
according to MIL-STD-810C, Test Method 502.1, the electronics module
shall be subjected to the functioning test of 4.5.1 at low
temperature. Observation shall be made for compliance with the
applicable requirements. (Non-Destructive Test)
4.5.4 Helicopter vibration. This test shall be performed as
specified in MIL-STD-810C, Test Method 514.2, Procedure IIc assuming
the number of missions to be greater than 100. The electronics
module shall be vibrated along three mutually perpendicular axes as
shown in Figure 1. The payload module shall be loaded with 30 inert
flares for this test. Following this test, examine each electronics
module for evidence of damage and submit each item to the
functioning test of 4.5.1. Observation shall be made for compliance
with the applicable requirements. (Non-Destructive Test)
4.5.5 Transportation vibration. This test shall be performed
as specified in MIL-STD-810C, Method 514.2, Procedure X using curve
AW of Figure 514.2-7 (change curve to 0.8" displacement (double
amplitude) between 5&6 Hz). The electronics module shall be
vibrated along three mutually perpendicular axes in Figure 2.
Following this test, examine each electronics module for evidence of
damage and submit each item to the functioning test of 4.5.1.
Observation shall be made for compliance with the applicable
(Non-Destructive Test)
requirments.
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