 |
|||
|
|
|||
| ||||||||||
|
|  MIL-E-63124B(AR)
AMENDMENT 2
*
3.4.2 Transportation vibration, line 3: Delete "M1L-STD-810C"
and substitute "MIL-STD-810, Method 514.4, Basic
Transportation, Category 7C".
*
3.4.3 Humidity, line 3: Delete "MIL-STD-810C" and substitute
"MIL-STD-810, Method 507.3, Procedure III".
*
3.4.4 High temperature, line 2: Delete "MIL-STD-810C, Test
Method 501.1" and substitute MIL-STD-810, Test Method 501.3,
Procedure II, Induced".
*
3.4.5 Low temperature, line 2: Delete "MIL-STD-810C, Test
Method 502.1" and substitute "MIL-STD-810, Test Method 502.3,
Procedure II, Severe cold".
*
3.4.6 Seal integrity, Delete in its entirety and substitute the
following:
3.4.6 Seal integrity. The electronics module assembly,
Dwg 9311431, shall show no evidence of leakage when tested as
specified in with 4.5.8".
PAGE 10
*
First article inspection:
TABLE 1.
Programmer
Assembly:
Delete
in
its
entirety.
Electronics Module Assembly (Dwg. 9311431): Add the
following after Humidity Test, "Seal integrity 2 3.4.6
4.5.8".
PAGE 12
4.4.2.1, Housing Assembly, Electronics:
Add alternate drawing
12598357 with drawing 9311565
PAGE 24
*
4.4.2.13 Programmer module, Major 103:
Delete in its entirety.
*
4.4.2.14 Module electronics, Major 106:
Add the following
"Seal integrity .40%
3.4.6
4.5.8".
PAGE 31
*
4.5.2 High temperature, line 2: Delete "MIL-STD-81OC, Test
Method 501.1" and substitute "MIL-STD-810, Test Method 501.3,
Procedure II, Induced".
2
|
|
Privacy Statement - Press Release - Copyright Information. - Contact Us |
Click
here for thousands of PDF manuals