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| MIL-E-63300A(AR)
APPENDIX
One hundred percent inspection. Delete and substitute the
following: "Level of inspection. Inspection of soldered
connections and associated wiring and leads shall be performed to
the level specified in the classification of defects in the product
specification. Table II of MIL-S-45743 provides a list of defects
with reference to the applicable requirements."
Delete.
Sampling inspection.
Visual inspection. Change to read, ".... a clear incandescent or
fluorescent light should be used for detection of uncovered copper."
Delete.
Cleanliness test.
30.2 Exceptions/clarifications to MIL-S-46844. The following
exceptions/clarifications to reference MIL-S-46844 paragraph titles
shall apply.
Flux ap plication. Change to read . . . . . even coated surface. Any
thinner used shall be a product from the flux manufacturer
recommended for the specified flux being utilized or a substitute
approved by the technical agency."
The solder contact. Add: "Bonded components or clinched leads are
acceptable restraints provided they are implemented in a manner to
assure that the leads do not move during the solder cycle."
Cleaning. Change to read . . . . . scraping shall not be used.
Residual flux, activators and soils shall be removed to the degree
approved by the technical agency using solvents or combination of
solvents which will remove contaminants."
Resistivity of solvent extract.
Delete.
One hundred percent inspection. Delete and substitute the
following: "Level of inspection. Inspection of soldered
connections and associated wiring and leads shall be performed to
the level specified in the classification of defects in the product
specification. Table 11 of MIL-S-45743 provides a list of defects
with reference to the applicable requirements."
Sampling inspection,
Delete.
visual inspection Change to read, . . . . . a clear incandescent or
fluorescent light should be used for detection of uncovered copper."
Cleanliness test.
Delete.
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