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Page Title:
Supplemental Solder Workmanship Standards |
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|  MIL-E-63300A(AR)
APPENDIX
40 SUPPLEMENTAL SOLDER WORKMANSHIP STANDARDS
40.1 General. The following solder workmanship standards
supplement the workmanship requirements contained in MIL-S-45743 and
MIL-S-46844 and are provided as additional aids in establishing the
minimum acceptance standards for soldering. All examinations will
be performed using a minimum 5 diopter lens. Suspected connections
may be examined using 10x magnification to determine acceptability.
40.2 Definitions.
40.2.1 Voids. All holes, pits, and voids regardless of size
are classified as voids.
40.2.1.2 Hole with solder plug. The total accumulative void
area on each side of hole is less than 20% of the hole area and does
not expose base metal. Also there are no voids through the board.
Evidence of good wetting at the pad surface,
40.2.1.3 Hole with leadwire. For solder side and component
side: the total accumulative void area is less than 20% of the lead
circumference; does not visibly expose base metal; leads adjacent to
voids exhibit good wetting and 100% solder coverage of the lead
surface. There are no voids through the board. The lead and pad
are wetted.
40.2.1.4 Twenty (20) % void. (For solder joint with a lead.)
Total void area equivalent to an area subtended by an arc equal to
20% of the lead circumference.
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