Electronics-MCD Assembly for Mine, Antitank: He, M75

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Electronics-MCD Assembly for Mine, Antitank: He, M75

Electronics-MCD Assembly for Mine, Antitank: He, M75
Applicable Documents
Applicable Documents -Cont.
Transportation, Parts 100-199
Physical Characteristics
Quiescent Current
Arming Actuator Signal
Detonator Fire Signal Output Energy
Quality Assurance Soldering Plan
Classification of Inspections
Requalification
Classification of Defects and Tests:Electronic-MCD Assy and Sub-Assemblies
Classification of Defects and Tests:Electronic-MCD Assy and Sub-Assemblies -Cont.
Inspection Lot Formation
Classification of Defects and Tests:Board, Printed Wiring
Classification of Defects and Tests:Printed Wiring Board Assembly
Classification of Defects and Tests: Electronics Assembly
Classification of Defects and Tests: Electronics Assembly ( Non-Destructive Tests )
Classification of Defects and Tests: Electronics Assembly ( Non-Destructive Tests ) -Cont.
Classification of Defects and Tests:Electronics-MCD Assembly Destructive Tests (Hot and Cold)
Classification of Defects and Tests:Electronics-MCD Assembly
Bushing, Power Supply
Core, Toroid
Magnetometer Assembly (Before Potting)
Capacitor, Fixed, Electrolytic-Tantalum, Solid
Capacitor, Fixed, Electrolytic-Tantalum, Solid -Cont.
Capacitor, Fixed, Plastic Dielectric (0.22 uF)
Capacitor, Fixed, Ceramic, Dielectric-Axial Lead
Capacitor, Ceramic, Fixed Dielectric, Molded, Axial
Fuse, Electric
Resistor ( 3 Megaohms, 5%, 1/4 W )
Resistor, Fixed Composition
Resistor, Fixed Film
Resistor, Fixed Film
Transistor (P/N 9287122-1, JAN 2N2907)
Transistor (P/N29287122-2, JAN 2N2222A)
Network, Resistor-Fixed and Adjustable
Network, Capacitor-Resistor
Network, Capacitor-Resistance
Switch Assembly
Diode, Hot Carrier ( JAN IN5711-MIL-S-19500/127)
Semiconductor Device, Diode
Semiconductor Device, Diode ( Type JAN IN750A-1)
Amplifier, Operational, Triple Progammable Micropower
Integrated Circuit , CMOS , Target Sensor
Microcircuit, Digital, CMOS ( Initial Logic)
Microcircuit, Digital, CMOS ( Final Logic )
Eyelet
Terminal, Stud
Coil
Wiring, Printed, Flexible
Receiver Coil Assembly
MCD Assembly
Standoff, ESP
Primer, Electric Battery
Housing, Electrical Assembly
Lid, Electronics Assembly
Connector, Edge Clip
Shorting Bar, Ceramic
Shorting Bar and Connector Assembly
Support Foam
Power Supply Assembly
Electronics-MCD Assembly
Potting Material Testing
Dimensional Control of Molded Parts
Quiscent Current Test
Low Voltage Detect Test
Magnetic Sensor Functioning Test
Reset Circuit
Variable Data
Potting Material Testing
Plating of AD Switch Can
Figure 1. Packaging
Figure 2. Packing
Ordering Data
Distribution of Ammunition Data Cards
Special Defect
Appendix: Supplemental Soldering Provisions
Exceptions and Clarifications
Hole with Solder Plug
Eyelet Connection Voids
Component Alignment
Magnetometer Soldering
Acceptable Protrusion of Wire
Irregular Surface; Slightly Convex Fillet
Bare Copper End of the Wire
Evidence of Solder Paste in Solder Connection
Evidence of Contamination in Solder Connection
Solder is Not Continously Wetted
Shorting Bar Soldering
Solder Buildup is Not Greater Than One Terminal Thickness
Terminal Edge Coincident with Pad Edge
Bridging Between Terminals
Terminal Overlaps Ceramic Substrate
Printed Wiring Board Assemblies
Minor Defect Inspection
Standardization Document Improvement Proposal

Electronics-MCD Assembly for Mine, Antitank: He, M75

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