Electric Power Equipment Basic Requirements

• Electric Power Equipment Basic Requirements
• Specifications, Standards, and Handbooks
• Specifications, Standards, and Handbooks -Cont.
• Specifications, Standards, and Handbooks -Cont.
• Specifications, Standards, and Handbooks -Cont.
• Specifications, Standards, and Handbooks -Cont.
• Specifications, Standards, and Handbooks -Cont.
• Specifications, Standards, and Handbooks -Cont.
• Specifications, Standards, and Handbooks -Cont.
• Specifications, Standards, and Handbooks -Cont.
• Specifications, Standards, and Handbooks -Cont.
• Other Government Documents, Drawings, and Publications
• Non Government Publications
• Design Improvements
• Mounting of Replaceable Items
• Use of Standard Electronic Modules (SEMs)
• Exposed Metal or Other Conductive Parts
• Temperature and Humidity
• Magnetic Field Reduction
• Provisions for Dynamic Balancing
• Portable and Permanently Installed Equipment
• Table I. Electrical Creepage and Clearance Distance
• Material Identification and Control
• Bolt and Screw Thread Engagement
• Self Locking Screws
• Utilization of Standard Tools
• Special Shipboard Environmental Conditions
• Table III. Maximum Concentration of Toxic Gases
• Flammable Materials
• Selection of Metals in Direct Contact
• Dials and Other Transparent and Translucent Applications
• Molded Thermosetting Plastics
• Colors of Thermosetting Plastics
• Classes and Definitions of Insulating Materials
• Accepted Tests
• Alternative Temperature Specification of Insulation Systems
• Class H Insulation Suitability
• Thermal Endurance Evaluation
• Core Tubes and Bobbins
• Binding Tape and Strips
• Lacing and Tying Cords for Vanished Coils and Windings
• Vacuum Pressure Impregnation (VPI)
• Treating Materials
• Encapsulants and Compounds Used on Coils and Windings
• Typical Treating Guidelines
• Insulation Suitability
• Wire , Wiring Methods , and Marking
• Table XIV. Hook-Up Wire
• Wiring Methods
• Lacing Cord
• External Cable Connections
• Marking of Hook-Up and Lead Wire
• Standard Marking for Connections
• Discrete Semiconductor Derating and Application Stresses
• Table XVI. Application Stress Limits and Derating Factors for Rectifiers
• Table XVI. Application Stress Limits and Derating Factors for Rectifiers -Cont.
• Table XVI. Application Stress Limits and Derating Factors for Rectifiers -Cont.
• Table XVI. Application Stress Limits and Derating Factors for Rectifiers -Cont.
• Microcircuit Derating
• Fuse Selective Blowing
• Fuseholder Installation Practice
• Fixed Tantalum ( Solid Electrolyte )
• Fixed Supermetallized Plastic Film Dielectric
• Rotary Switches
• Toggle Switch Mounting
• Table XVII. Indicator Style and Specifications
• Figure 1. Holder Face
• Figure 2. Lens Engraving Details
• Solid State Relays
• Lower Current Applications
• Electrstatic Discharge (ESD) Susceptible Items
• Transducers
• Miscellaneous Inductive Devices
• Shield Grounding Ferrules
• Non Repairable Assemblies
• Power Sensing Relays
• Table XIX. Painting of Metal for Corrosion Resistance
• Interior Surfaces of Motors and Generators
• Normal Painting Procedure
• Soldering for Windings
• Thermal Design
• Specific Cooling Systems
• Direct Cooling of Electrical Components
• Lubrication Design and Lubricants
• High Voltage Equipment
• Warning and Caution
• Reference Designation Locations
• Manufacturing Screening Tests
• Equipment Energization
• Low Quantity and Non -QPL Qualified Transformers
• Inspection Requirements for Low Quantity and Non-QPL Qualified
• Quality Conformance Inspection
• Insulation Resistance Tests
• Arc and Tracking Resistance
• Airborne and Structureborne Noise Test
• Procedure
• Measurement of Ambient Temperature for Heat Runs
• Equipment Cooled by Water
• Acquisition Requirements
• Consideration of Data Requirements
• Technical Manuals
• Definitions and Nomenclature
• Requirements for Approval
• Subject Term ( Key Word ) Listing
• Appendix A: Procedure for Insulation Suitability Tests
• Applicable Documents
• Insulation Suitability Tests
• High Potential Test Equipment
• Capacitance and Dissipation Factor
• Criterion of Failure
• Table XXII. Insulation Suitability Test 100 Percent Relative Humidity Plus Dew
• Figure 4. Insulation Resistance
• Figure 5. Dissipation Factor
• Appendix B: Essential Characteristics
• Procedures for Drawings
• Qualified Products
• Non-Standard Microcircuits
• Appendix C: Engineering Drawings Technical Content Requirements
• Index
• Index -Cont.
• Index -Cont.
• Index -Cont.
• Index -Cont.
• Index -Cont.
• Standardization Document Improvement Proposal
• Blank Page
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Electric Power Equipment Basic Requirements

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