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| MIL-F-48267 (PA)
Any IC failing to comply with all of the specified requirements
of 3.9 shall be classed defective. Testing is non-destructive
and only accepted IC's shall be returned to the lot.
4.4.7 Group A Final Static High Temperature Electrical
Parameters. - The IC shall be tested for the specified require-
ments of 3.10 using a Teredyne IC Test Set NO.- J283 with H360
test check and 36 channel capacity and the load card of drawing
9278639. The test conditions and limits shall be placed on a
Tri-Data 10 foot tape No. 1010 or equivalent tape compatible with
the test equipment. Any IC failing to comply with all of the speci-
fied requirements of 3.10 shall be classed defective. Testing is
non-destructive and only accepted IC's shall be returned to the lot.
4.4.8 Group A Final Static Low Temperature Electrical
Parameters. - The IC shall be tested for the specified require-
ments of 3.11 using a Teredyne IC Test Set No. J283 with H360
test check and 36 channel capacity and the load card of drawing
9278639. The test conditions and limits snail be placed on a
Tri-Data 10 foot tape No. 1010 or equivalent tape compatible with
the test equipment. Any IC failing to comply with all of the speci-
fied requirements of 3.11 shall be classed defective. Testing is
non-destructive and only accepted IC's shall be returned to the lot.
4.4,9 Dynamic Parameter Tests. - The IC shall be tested
using the Dynamic Test Set, dwg. 9278641 for the specified re-
quirements of 3.12. Any IC failing to comply with all of the
requirements of 3.12 shall be classed defective and removed from
the lot. Testing is non-destructive and only accepted IC's shall
be returned to the lot.
4.4.10 Group B Environmental Tests. - The IC shall be
tested using Government approved test equpment and procedures.
Any IC failing to comply with all of the specified requirements
of 3.13 shall be classed defective. Tested IC's shall not be
returned to the lot.
4.4.11 Group C Environmental Tests. - The XC shall be
tested using Government approved test equipment and procedures.
Any IC failing to comply with all of the specified requirements
of 3.14 shall-be classed defective. Tested IC's shall not be
returned to the lot.
PREPARATION FOR DELIVERY
5.
5.1 Preservation and Packaging
5.1.1 IC Conductive Packaging. - Each IC shall be mounted
into Emmerson and Cummings, Inc. "ECCOSORB" conductive material
or equivalent prior to packaging.
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