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|  MIL-I-48331A(AR)
Contractor to investigate, perform failure
e.
analysis and take corrective action.
b.
Assessment of Material processed to data for
conformance.
Contractor to supply documentation.
c.
3.21 Workmanship. The integrated Circuit shall be
fabricated and finished in a thorough, workmanlike manner. It
shall be free of burrs, chips, sharp edges, cracks, unblended
radii, surface defects, dirt, grease, rust, corrosion products,
and other foreign matter. The cleaning method used shall not
be injurious to the Integrated Circuit nor shall the parts be
contaminated by the cleaning agents. All markings and
stampings shall be free of harmful cleaning and soldering
agents that may be injurious to the IC. All markings and
stampings, shall be displayed and visibly defined. The IC
shall be manufactured and/or processes in such a manner as to
be uniform in quality and free from defects that will affect
life, configuration and serviceability.
3.22 Qualification. The integrated circuit shall be
subjected to another first article if:
The contractor's manufacturing techniques or
a.
process controls which affect the form, fit,
function or internal geometry of the IC are
revised by either the contractor or one of his
sub-contractors supplying parts or assemblies.
The contractor relocates his assembly facilities.
b.
c.
The contractor uses a new sub-contractor for
material, parts or assembly.
d.
A change in material used for integrated circuit
process or assembly.
Qualification requirements shall be determined by the
Government for each change, (See Table I, requirements).
3.23 First article inspection. This specification
contains provisions for first article inspection. Requirements
for the submission of first article samples by the contractor
shall be specified in the contract, see Table I.
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