Modules, Standard Electronic General Specification

Click here to make tpub.com your Home Page

Page Title: Modules, Standard Electronic General Specification

Click here for thousands of PDF manuals

Web
www.tpub.com

Information Categories

....

Administration
Advancement
Aerographer
Automotive
Aviation
Construction
Diving
Draftsman
Engineering
Electronics
Food and Cooking
Logistics
Math
Medical
Music
Nuclear Fundamentals
Photography
Religion

Modules, Standard Electronic General Specification

Modules, Standard Electronic General Specification
Classification
Specifications, standards and handbooks
Specifications, standards and handbooks-cont.
Other Government publications
Associated detail specifications
Thick film multilayer interconnect boards (MIBs) and assemblies
Mechanical integrity requirements
Connector integrity
Critical component temperature (CCT)
Transient critical component temperature (TCCT)
Operating environmental requirements
Nonoperating environmental requirements
Thermal cycle
Joint Army Navy (JAN) and J marking
Metallic surfaces
Responsbility for inspection
Inspection conditions
Failure rate and parts derating
Table 1. Qualification inspection
Design conformance
Proven design and construction technology
Acceptance and rejection criteria
Failure analysis
Test equipment and facilities
Table 2. Quality conformance inspections and test plan
Procurement source control for radiation hardened devices
Maintenance and calibration of inspection and test equipment
Contractor's plan of control
Manufacturing flow chart
Process control procedures
Process certification
Accumulation and analysis of defect data
Electrostatic discharge control program
Keying pin cantilever load
Module torque
Operating temperature tests
Vibration test (classes I and III)
Vibration test (classes II and IV)
Barometric pressure (reduced)
Ionizing dose rate
Durability
Thermal shock
Hydrogen atmosphere
Direct air impingement tests
Transient critical component temperature (TCCT) test
Intermediate packs
Standard marking
Army acquisitions
Data requirements for qualification
Data requirements for qualification-cont.
Consideration of data requirements
Acquisition activity concerned
Request for deviation or waiver
Disposition of nonconforming material
JAN marking
Figure 1. Rib strength
Figure 2. Module torque
Figure 3. Module header torque
Figure 4. Module cantilever load
Figure 5. Pin shield retention
Figure 6. Operating temperature cycle
Figure 6. Operating temperature cycle-cont.
Appendix A. Standard Electronic Module Tester Correlation
Correlation and Proof Modules
Repair and retesting of correlation and proof modules
Tester Facility Requirements
Test procedure documentation
Correlation testing
Recording information on the correlation data sheet
Recorrelation criteria
Calculation and Application of Tester Offsets and Correlation Tolerances
Parameter tolerance equal to or greater than 3 percent
Parameter tolerance less than 3 percent
Parameter tolerance undefined in terms of percent
Test equipment accuracy deviation
Figure 7. Tester correlation report format
Appendix B. Thick Film Multilayer Interconnect Board Performance Specification
Other Government publications
Ceramic blank
Table 3. Conductor paste requirements
Dielectric viscosity
Overglaze solids content
Completed multilayer interconnect board requirements
Electrical characteristics
MIB workmanship and quality of fired print
Table 5. Visual reject criteria for defects
Table 5. Visual reject criteria for defects-cont.
Table 5. Visual reject criteria for defects-cont.
Table 5. Visual reject criteria for defects-cont.
Construction integrity
Quality Assurance Provisions
Manufacturing process flow
Coupon processing
Table 6. Conductor material inspection
Table 7. Dielectric material inspection
Table 8. Overglaze material inspection
Conductor paste, dielectric paste or overglaze sample plan
Table 10. Sample plan
MIB qualification sample plan
Table 11. Multilayer interconnect board inspection
Bias and humidity sampling
Destructive analysis
Metallization adhesion
Current leakage
Land adhesion
Ionic or resistivity of solvent extract
Resistivity of solvent extract
Dielectric withstanding voltage
Sample preparation
Dielectric constant
Average manufacturer throughput interval (AMTI)
Master drawing information
Master drawing information-cont.
Figure 8a. Chip out criteria (dielectric)
Figure 9. Test coupon levels
Figure 10. Applications of coupon levels
Figure 11. 90 degree wire pull test
Figure 12. Tensile Test
Index
Index-cont.
Index-cont.
Index-cont.
Index-cont.
Index-cont.
Index-cont.
Index-cont.
Modules, Standard Electronic General Specification
Supplement I. Associated Detail Specifications-cont.
Supplement I. Associated Detail Specifications-cont.
Supplement I. Associated Detail Specifications-cont.
Supplement I. Associated Detail Specifications-cont.
Supplement I. Associated Detail Specifications-cont.
Supplement I. Associated Detail Specifications-cont.
Supplement I. Associated Detail Specifications-cont.
Supplement 1. Inactive for Design
Supplement 1. Inactive for Design-cont.
Supplement 1. Cross Reference by Key Code
Supplement 1. Cross Reference by Key Code-cont.
Supplement 1. Cross Reference by Key Code-cont.
Supplement 1. Cross Reference by Key Code-cont.
Supplement 1. Cross Reference by Name
Supplement 1. Cross Reference by Name-cont.
Supplement 1. Cross Reference by Name-cont.
Supplement 1. Cross Reference by Name-cont.
Supplement 1. Cross Reference by Name-cont.
Supplement 1. Cross Reference by Name-cont.
Supplement 1. Cross Reference by Name-cont.

Modules, Standard Electronic General Specification

Privacy Statement - Press Release - Copyright Information. - Contact Us

Integrated Publishing, Inc. - A (SDVOSB) Service Disabled Veteran Owned Small Business