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|  MIL-M-38510/101H
4.5 Methods of inspection. The methods of inspection shall be specified in the appropriate tables. Electrical test circuits as
prescribed herein or in the referenced test methods of MIL-STD-883 shall be acceptable. Other test circuits shall require the
approval of the qualifying activity.
4.5.1 Voltage and current. All voltage values given, except the input offset voltage (or differential voltage) are referenced to
the external zero reference level of the supply voltage. Currents given are conventional current and positive when flowing into
the referenced terminal.
4.5.2 Burn-in and life test cooldown procedure. When devices are measured at +25C following application of the steady
state life or burn-in condition, they shall be cooled to within 10C of their power stable condition at room temperature prior to
removal of the bias.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-M-38510.
6. NOTES
6.1 Intended use. Microcircuits conforming to this specification are intended for Government microcircuit applications
(original equipment) and logistic purposes.
6.2 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the
time of award of contract, qualified for inclusion in Qualified Manufacturers List QML-38535 whether or not such products have
actually been so listed by that date. The attention of the contractors is called to these requirements, and manufacturers are
urged to arrange to have the products that they propose to offer to the Federal Government tested for qualification in order that
they may be eligible to be awarded contracts or purchase orders for the products covered by this specification. Information
pertaining to qualification of products may be obtained from DSCC-VQ, 3990 E. Broad Street, Columbus, Ohio 43213-1199.
6.3 Ordering data. The contract or purchase order should specify the following:
a.
Complete part number (see 1.2).
b.
Requirements for delivery of one copy of the quality conformance inspection data pertinent to the device
inspection lot to be supplied with each shipment by the device manufacturer, if applicable.
c.
Requirements for certificate of compliance, if applicable.
d.
Requirements for notification of change of product or process to acquiring activity in addition to
notification of the qualifying activity, if applicable.
e.
Requirements for failure analysis (including required test condition of MIL-STD-883, method 5003),
corrective action and reporting of results, if applicable.
f.
Requirements for product assurance options.
g.
Requirements for special lead lengths or lead forming, if applicable. These requirements shall not affect
the part number.
h.
Requirements for "JAN" marking.
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