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| MIL-M-38510/118B
1.3 Absolute maximum ratings.
Input voltage (device types 01 and 02) ...........................................................
-40 V
Input-output differential voltage (device types 03 and 04) ...............................
-40 V
+300C
Lead temperature (soldering, 60 seconds) .....................................................
+150C 1/
Junction temperature (TJ) ...............................................................................
-65C to +150C
Storage temperature range ............................................................................
1.4 Recommended operating conditions.
Input voltage range:
Device types 01 and 02 .............................................................................. -8 V dc to -38 V dc
Device types 03 and 04 .............................................................................. -4.25 V dc to 41.25 V dc
Ambient operating temperature range (TA) .................................................... -55C to +125C
1.5 Power and thermal characteristics.
Maximum PD
Maximum PD
Max θJA
Max θJC
Max θC-S 2/
Case
TA = TS
with heat sink
with heat sink
125C 3/
140C/W
40C/W
10C/W
X
0.18 W
0.5 W
35C/W
4C/W
0.5C/W
Y
0.71 W
5.6 W
25C
140C/W
40C/W
10C/W
X
0.89 W
2.50 W
35C/W
4C/W
0.5C/W
Y
3.60 W
28.00 W
-55C
140C/W
40C/W
10C/W
X
1.50 W
4.00 W
35C/W
4C/W
0.5C/W
Y
5.80 W
45.00 W
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1/ The device is protected by a thermal shutdown circuit which is designed to turn off the output transistor whenever
the device junction temperature is in excess of 150C.
2/ This value represents the maximum allowable thermal impedance of a heat sink to remain within the thermal ratings.
3/ Based on TJ = 150C and specified values of θJA and θJC.
2
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