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|  MIL-M-38510/207E
1.3 Absolute maximum ratings.
Supply voltage range ....................................................................
-0.5 V dc to +7.0 V dc
Input voltage range .......................................................................
-1.5 V dc at -10 mA to +5.5 V dc
-65 to +150C
Storage temperature range ...........................................................
+300C
Lead temperature (soldering, 10 seconds) ....................................
Thermal resistance, junction to case (θJC):
See MIL-STD-1835 1/
Cases E and F ........................................................................
Output voltage applied ..................................................................
-0.5 V dc to +VCC
Output sink current ........................................................................
100 mA
Maximum power dissipation (PD) ..................................................
739 mW dc 2/
Maximum junction temperature (TJ) .............................................. +175C 3/
1.4 Recommended operating conditions.
Supply voltage range (VCC) .......................................................... +4.5 V dc minimum to
+5.5 V dc maximum
Minimum high-level input voltage (VIH) ......................................... 2.0 V dc
Maximum low-level input voltage (VIL) .......................................... 0.8 V dc
Normalized fanout (each output) ................................................... 16 mA
Case operating temperature range (TC) ........................................ -55 C to +125 C
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of
this specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications and Standards. The following specifications and standards form a part of this
specification to the extent specified herein. Unless otherwise specified, the issues of these documents are those
cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38535 -
Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
-
Test Method Standard for Microelectronics.
MIL-STD-1835
-
Interface Standard Electronic Component Case Outline
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or
http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,
Philadelphia, PA 19111-5094.)
____
1/ Heat sinking is recommended to reduce the junction temperature.
2/ Must withstand the added PD due to short circuit test (e.g. IOS).
3/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in
screening conditions per method 5004 of MIL-STD-883.
2
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