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|  MIL-M-38510/758B
4.5 Methods of inspection. Methods of inspection shall be specified and as follows:
4.5.1 Voltage and current. Unless otherwise specified, all voltages given are referenced to the microcircuit GND terminal.
Currents given are conventional current and positive when flowing into the referenced terminal.
4.5.2 Burn-in and life test cool down procedures. When the burn-in and life tests are completed and prior to removal of bias
voltages, the devices under test (DUT) shall be cooled to within 10C of their power stable condition at room temperature; then,
electrical parameter end-point measurements shall be performed.
4.5.3 Quiescent supply current. When performing quiescent supply current measurements (ICC), the meter shall be placed so
that all currents flow through the meter.
5. PACKAGING
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2).
When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the
responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the Inventory
Control Point's packaging activity within the Military Service or Defense Agency, or within the military service's system
commands. Packaging data retrieval is available from the managing Military Department's or Defense Agency's automated
packaging files, CD-ROM products, or by contacting the responsible packaging activity.
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)
6.1 Intended use. Microcircuits conforming to this specification are intended for original equipment design application and
logistic support of existing equipment.
6.2 Acquisition requirements. Acquisition documents should specify the following:
a.
Title, number, and date of the specification.
b.
PIN and compliance identifier, if applicable (see 1.2).
c.
Requirements for delivery of one copy of the conformance inspection data pertinent to the device inspection lot to be
supplied with each shipment by the device manufacturer, if applicable.
d.
Requirements for certificate of compliance, if applicable.
e.
Requirements for notification of change of product or process to contracting activity in addition to notification to the
qualifying activity, if applicable.
f.
Requirements for failure analysis (including required test condition of method 5003 of MIL-STD-883), corrective
action and reporting of results, if applicable.
g.
Requirements for product assurance and radiation hardness assurance options.
h.
Requirements for special carriers, lead lengths, or lead forming, if applicable. These requirements should not affect
the PIN. Unless otherwise specified, these requirements will not apply to direct purchase by or direct shipment to the
Government.
i.
Requirements for "JAN" marking.
j.
Packaging requirements (see 5.1).
6.3 Superseding information. The requirements of MIL-M-38510 have been superseded to take advantage of the available
Qualified Manufacturer Listing (QML) system provided by MIL-PRF-38535. Previous references to MIL-M-38510 in this
document have been replaced by appropriate references to MIL-PRF-38535. All technical requirements now consist of this
specification and MIL-PRF-38535. The MIL-M-38510 specification sheet number and PIN have been retained to avoid
adversely impacting existing government logistics systems and contractors parts lists.
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