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Page Title:
Recommended operating conditions. |
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|  MIL-M-38510/9E
1.3 Absolute maximum ratings.
Supply voltage range (VCC) .......................................................
-0.5 V dc to +7.0 V dc
Input voltage range ....................................................................
-1.5 V dc at -12 mA to +5.5 V dc
Storage temperature range .......................................................
-65C to +150C
Maximum power dissipation per register, PD 1/
Device type 01 ....................................................................
422 mW dc
Device type 02 ....................................................................
400 mW dc
Device type 03 ....................................................................
322 mW dc
Device type 04 ....................................................................
372 mW dc
Device type 05 ....................................................................
360 mW dc
Device type 06 ....................................................................
372 mW dc
Lead temperature (soldering 10 seconds) .................................
300C
Thermal resistance, junction-to-case (θJC).................................
(See MIL-STD-1835)
175C
Junction temperature (TJ ) 2/ .....................................................
1.4 Recommended operating conditions.
Supply voltage (VCC) ..................................................................
4.5 V dc minimum to 5.5 V dc maximum
Minimum high level input voltage ..............................................
2.0 V dc
Maximum low level input voltage ...............................................
0.8 V dc
-55C to 125C
Case operating temperature range (TC ) ....................................
Fan out
Device types 01, 02, 04, 05, and 06
High logic level ............................................................
20
Low logic level .............................................................
10
Device type 03
High logic level ............................................................
10
Low logic level .............................................................
5
Device type 01
Low level setup time at mode control
with respect to clock 1 input ........................................
35 ns minimum
High level setup time at mode control
with respect to clock 2 input ........................................
35 ns minimum
Low level setup time at mode control
with respect to clock 2 input ........................................
10 ns minimum
High level setup time at mode control
with respect to clock 1 input ........................................
10 ns minimum
Width of clock pulse ...........................................................
20 ns minimum
Setup time required at serial A, B, C, D inputs ...................
20 ns minimum
Hold time required at serial A, B, C, D inputs .....................
5 ns minimum
Device type 02
Minimum clock pulse width .................................................
35 ns maximum
Minimum clear pulse width .................................................
30 ns maximum
Minimum preset pulse width ...............................................
30 ns maximum
Serial input setup time ........................................................
30 ns minimum
Serial input hold time ..........................................................
0 ns minimum
Device type 03
Minimum clock pulse width .................................................
30 ns maximum
Minimum clear pulse width .................................................
50 ns maximum
Serial setup time ................................................................
15 ns minimum
Serial hold time ..................................................................
10 ns maximum
_______
1/ Must withstand the added PD due to short circuit condition (e.g. IOS) at one output for 5 seconds duration.
2/ Maximum junction temperature should not be exceeded except in accordance with allowable short
duration burn-in screening condition in accordance with MIL-PRF-38535.
2
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