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| ![]() MIL-N-81857(AS)
(1) M i c r o e l e c t r o n i c Technology shall be consi-
d e r e d and microelectronic items shall conform
t o requirements specified herein.
(2) O t h e r parts and materials requirements shall
c o n f o r m to Specification MIL-E-5400.
(3) N o n r e p a i r a b l e subassemblies shall be used in
accordance with Specification AR-10 and as
o u t l i n e d in Specification MIL-E-5400.
(4) When previously produced models of this
equipment did not use nonrepairable subas-
semblies, the design shall not be changed
to employ nonrepairable assemblies without
the approval of the procuring activity.
Nonstandard Parts and Materials Approval -
3.2.1
Approval for the use of nonstandard parts and materials (including
electron tubes, transistors and diodes ) other than microelectronic
devices shall be obtained as outlined in Specification MIL-E-5400.
M i c r o e l e c t r o n i c devices shall be approved as outlined in AR-5.
M i c r o e l e c t r o n i c Modular Assemblies - When used,
3.2.2
M i c r o e l e c t r o n i c Modular Assemblies shall meet the requirements
o f Specification AR-5. Conformal coatings, encapsulant, embed-
ments or potting materials used with modular assemblies containing
i n t e g r a t e d circuits and discrete parts shall be easily removable
without damage to the assembly.
M o d u l e s - The electronic portions of the equipment
3.2.3
shall be functionally modularized in accordance with Specification
AR-10.
M o t o r s - A l l motors shall have sealed bearings .
3.2.4
that do not require lubrication or other service for a minimum of
5000 hours of equipment operation.
3.3
Design and Construction - The equipment shall con-
f o r m with all the applicable requirements of Specification MIL-E-5400
f o r design, c o n s t r u c t i o n and workmanship, except as otherwise spe-
c i f i e d herein.
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