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| MIL-N-85005A(AS)
Where high density packaging techniques are
(2) 5.1.5.3
used, 0.0065 inch minimum spacing may be used
between the outer periphery of a plated through
hole terminal area and an adjacent conductor.
In such a case the voltage between conductors
shall be limited to 20 volts DC or AC peak.
Jumper wires may be added to existing terminal
(3) 5,1.6,
areas to supplement the original etched pattern,
5.2.1,
where authorized by approved design changes.
5.3.1
When heat sink core construction is used, com-
ponent leads may be soldered to a flat surface
pattern on the component side of the board,
using approved contractor processes.
(4) 5.1.7.2,
The requirement for solder plating and tin-lead
5.5.4
coating shall not apply to areas covered by a
heat sink. On high density boards, the solder
plug shall wet a minimum of 0.001 inch outward
from the hole. Continuous solder plug filling
of the interracial plated-through holes shall
not be required.
(5) 5.2.2
The size of terminal areas may be reduced where
standard military specification components have
terminal spacing which is incompatible with the
requirements of this paragraph. Where high
density packaging techniques are used, the
surrounding area shall be at least 0.012 inch
greater than the diameter of the hole.
(6) 5.3.2,
Hole-to-lead size difference shall not exceed
0.034 inch.
5.5.3
The part attachment method of Paragraph 5.2.1.3
(7) 5.7.1,
may be used.
5.2.1.1
Component leads may not necessarily be clinched
(8) 5.7.1.2
in alignment with the conductor path. The leads
may extend beyond the edge of the terminal area
and may not necessarily make contact with the
conductor pattern before soldering.
Where feasible, straight-through leads shall
(9) 5.7.1.3
be swaged. Clearance for component leads which
extend beyond the foil surface more than 0.060
inch shall be a design consideration and shall be
specified on the drawing.
The outline of the lead shall be visible in
(10) 5.7.1.4
the solder.
-8-
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