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|  MIL-M-38510/245B
4.2 Screening. Screening shall be in accordance with MIL-PRF-38535 and shall be conducted on all devices prior to
qualification and quality conformance inspection. The following additional criteria shall apply:
a. Delete the sequence specified in 3.1.9 through 3.1.13 of method 5004 and substitute lines 1 through 5 of table II
herein.
b. Burn-in test (method 1015 of MIL-STD-883).
(1) Static test (test condition A) Ambient temperature (TA) shall be +125C minimum. Test duration for the
static test shall be 48 hours minimum for class S. The 48 hour burn-in shall be broken into two sequences
of 24 hours each (static I and static II) followed by interim electrical measurements. Static II for class B is a
minimum of 168 hours.
(2)
Dynamic test (test condition D or E) Test duration and temperature shall be in accordance with method 5004
of MIL-STD-883.
c. Interim and final electrical test parameters shall be as specified in table II (see 3.6).
d. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained
under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-
PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
test method 1015 of MIL-STD-883.
e. For Class S devices, post dynamic burn-in, or Class B devices, post dynamic burn-in, electrical parameter
measurements may, at the manufacturer's option, be performed separately or included in the final electrical
parameter measurements.
f. The manufacturer's of SOS devices shall use a high temperature stress test prior to the static burn-in. Conditions
shall be static, TA = 125C, supply voltage at 6.5 V minimum, and a duration of 48 hours minimum for classes S
and B. The stress test circuit is figure 3, static I, all ones pattern. A PDA of 5 percent shall be imposed. Devices
need not be serialized prior to stress testing.
g. At the manufacturer's option, the following visual inspection method shall be used. For class S, visual inspection is
to be performed to MIL-STD-883, method 2010, condition A except as follows:
(1)
High magnification inspection is performed at 100X to 300X.
(2)
Condition A criteria 3.1.1.1 and 3.1.1.2 shall be replaced by condition B criteria 3.1.1.1 and 3.1.1.2
respectively, however the 75 percent of the original metal width over a passivation step requirements shall be
reduced to 50 percent, and underlying oxide must also be exposed.
(3)
Criteria 3.1.1.7 shall apply to 3 areas, two opposite corners and one area in the center of sufficient complexity
to assure general alignment and contact coverage, and consist only of the area in the immediate field of view.
(4)
Condition A criteria 3.1.3c shall be replaced by condition B criteria 3.1.3c. Cracks greater than 5 mils are
rejected only if they point to or cross the scribe grid line.
Burn in testing shall be performed at an operating voltage of 6 .5 volts, if this option is chosen..
(5)
h. At the manufacturer's option, the class B visual inspection is to be performed to MIL-STD-883, method 2010,
condition B except as follows:
(1)
Condition B criteria 3.1.1.1 and 3.1.1.2 metallization scratches and voids, the 75 percent of the original metal
width over a passivation step requirements shall be reduced to 50 percent, and underlying oxide must also be
exposed.
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