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Correctness of indexing and marking. |
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|  MIL-M-38510/245B
3. REQUIREMENTS
3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before contract award
(see 4.3 and 6.3).
3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as specified
herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not
affect the form, fit, or function as described herein.
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535 and herein. At present epoxy die bonding may be performed using qualified conductive silver
paste or qualified (nonepoxy) silver filled glass. All epoxies must be qualified to method 5011 to of Mil-STD-883. Laser
scribing shall be allowed only for SOS technology product and only to the back side of the wafer.
3.3.1 Terminal connections. The terminal connections and logic diagrams shall be as specified on figures 1.
3.3.2 Block diagram. The block diagram shall be as specified on figures 2.
3.3.3 Switching time test circuit. The switching time test circuit shall be as specified on figure 3.
3.3.4 Truth table and timing waveforms. The truth tables and timing waveforms shall be as specified on figure 4.
3.3.5 Case outlines. The case outlines shall be as specified in 1.2.3.
3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).
3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table I, and apply
over the full recommended case operating temperature range, unless otherwise specified.
3.5.1 Post-irradiation performance characteristics. The electrical performance characteristics of radiation hardness
assured devices following exposure to the designated radiation levels are as specified in table VI and apply at an ambient
temperature of +25C.
3.6 Electrical test requirements. The electrical test requirements for each device class shall be the subgroups specified in
table II. The electrical tests for each subgroup are described in table III.
3.6.1 Functional tests. The functional tests used to test these devices are contained in the appendix. If the test patterns
cannot be implemented due to test equipment limitations, then alternate test patterns to accomplish the same results shall be
submitted to the qualifying activity for approval.
3.7 Marking. Marking shall be in accordance with MIL-PRF-38535.
3.7.1 Serialization. All class S devices shall be serialized I accordance with MIL-PRF-38535.
3.7.2 Correctness of indexing and marking. All devices shall be subjected to the final electrical test specified in table II
after marking to verify that they are correctly indexed and identified by part number. Optionally, an approved electrical test
may be devised especially for this requirement.
Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group number 41
3.8
(see MIL-PRF-38535.)
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not effect the
form, fit, or function as described herein.
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