Microcircuits, Digital, CMOS, 4096 BIT, Static Random Access Memory (SRAM), Bulk Silicon and Silicon on Sapphire

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Microcircuits, Digital, CMOS, 4096 BIT, Static Random Access Memory (SRAM), Bulk Silicon and Silicon on Sapphire

Microcircuits, Digital, CMOS, 4096 BIT, Static Random Access Memory (SRAM), Bulk Silicon and Silicon on Sapphire
Recommended operating conditions.
Correctness of indexing and marking.
Screening.
Technology Conformance inspection (TCI).
The steady-state life test duration, test condition, and test temperature
Table 1. Electrical performance characteristics.
Table 1. Electrical performance characteristics-cont.
Table 1. Electrical performance characteristics-cont.
Table 1. Electrical performance characteristics-cont.
Table 1. Electrical performance characteristics-cont.
Table 2. Electrical test requirements.
Figure 1. Terminal connections.
Figure 2. Block diagrams.
Figure 2. Block diagrams Device type 05
Figure 3. Switching time test circuit.
Figure 4. Read cycle, write cycle, read/modify/write cycle waveforms and truth tables.
Figure 4. Read cycle, write cycle, read/modify/write cycle waveforms and truth tables Device types 01 and 03
Figure 4. Read cycle, write cycle, read/modify/write cycle waveforms and truth tables Device types 01 and 03-cont.
Figure 4. Read cycle, write cycle, read/modify/write cycle waveforms and truth tables Device types 02 and 04
Figure 4. Read cycle, write cycle, read/modify/write cycle waveforms and truth tables Device types 02 and 04-cont.
Figure 4. Read cycle, write cycle, read/modify/write cycle waveforms and truth tables Device types 02 and 04-cont.
Figure 4. Read-cycle timing waveforms.
Figure 4. Write-cycle timing waveforms.
Figure 4. Write-cycle timing waveforms Device type 06
Figure 4. Read-cycle timing waveforms.
Figure 5. Timing test conditions over operating temperature range.
Figure 5. Timing test conditions over operating temperature range-cont.
Table 3. Group A inspection for device type 01.
Table 3. Group A inspection for device type 01-cont.
Table 3. Group A inspection for device type 01-cont.
Table 3. Group A inspection for device type 01-cont.
Table 3. Group A inspection for device type 01-cont.
Table 3. Group A inspection for device type 01-cont.
Table 3. Group A inspection for device type 02.
Table 3. Group A inspection for device type 02-cont.
Table 3. Group A inspection for device type 02-cont.
Table 3. Group A inspection for device type 02-cont.
Table 3. Group A inspection for device type 02-cont.
Table 3. Group A inspection for device type 02-cont.
Table 3. Group A inspection for device type 03
Table 3. Group A inspection for device type 03-cont.
Table 3. Group A inspection for device type 03-cont.
Table 3. Group A inspection for device type 03-cont.
Table 3. Group A inspection for device type 03-cont.
Table 3. Group A inspection for device type 03-cont.
Table 3. Group A inspection for device type 04
Table 3. Group A inspection for device type 04-cont.
Table 3. Group A inspection for device type 04-cont.
Table 3. Group A inspection for device type 04-cont.
Table 3. Group A inspection for device type 04-cont.
Table 3. Group A inspection for device type 04-cont.
Table 3. Group A inspection for device type 05
Table 3. Group A inspection for device type 05-cont.
Table 3. Group A inspection for device type 05-cont.
Table 3. Group A inspection for device type 05-cont.
Table 3. Group A inspection for device type 05-cont.
Table 3. Group A inspection for device type 05-cont.
Table 3. Group A inspection for device type 06
Table 3. Group A inspection for device type 06-cont.
Table 3. Group A inspection for device type 06-cont.
Table 3. Group A inspection for device type 06-cont.
Table 3. Group A inspection for device type 06-cont.
Table 3. Group A inspection for device type 06-cont.
Table 3. Group A inspection for device type 06-cont.
Table 3. Group A inspection for device type 06-cont.
Table 3. Group A inspection for device type 06-cont.
Table 3. Group A inspection for device type 06-cont.
Total dose irradiation testing.
Packaging requirements.
Table 6. Post-irradiation end-point electrical parameters
Table 7. Bias during exposure to radiation.
Abbreviations, symbols, and definitions.
Timing parameter abbreviations.
Substitutability.
Appendix A. Functional Algorithms
Checkerboard
Custodians

Microcircuits, Digital, CMOS, 4096 BIT, Static Random Access Memory (SRAM), Bulk Silicon and Silicon on Sapphire

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