Microcircuits, Digital, Schottky TTL, 1024 BIT Random Access Memory (RAM), Monolithic Silicon

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Microcircuits, Digital, Schottky TTL, 1024 BIT Random Access Memory (RAM), Monolithic Silicon

Microcircuits, Digital, Schottky TTL, 1024 BIT Random Access Memory (RAM), Monolithic Silicon
Absolute maximum ratings.
Item requirements.
Table 1. Electrical performance characteristics.
Table 1. Electrical performance characteristics-cont.
Technology Conformance inspection (TCI).
Figure 1. Case outline X (24 lead, 3/8" x 3/8" flat package).
Figure 1. Case outline X (24 lead, 3/8" x 3/8" flat package)-cont.
Figure 2. Terminal connections.
Figure 3. Truth tables.
Figure 3. Truth tables Device types 10, 12, 14, and 15
Figure 4. Logic diagrams.
Figure 4. Logic diagrams device types 02, 04, 06, 08, and 13
Figure 4. Logic diagrams device types 09, 10, 11, 12, 14, and 15
Figure 5. Switching time load circuits, test conditions and waveforms.
Figure 5. Switching time load circuits, test conditions and waveforms Device types 01, 03, 05 and 07
Figure 5. Switching time load circuits, test conditions and waveforms Device types 02, 04, 06, 08 and 13
Figure 5. Switching time load circuits, test conditions and waveforms Device types 02, 04, 06, 08 and 13-cont.
Figure 5. Switching time load circuits, test conditions and waveforms Device types 09 and 11
Figure 5. Switching time load circuits, test conditions and waveforms Device types 10, 12, 14, and 15
Table 3. Group A inspection for device types 01 and 05.
Table 3. Group A inspection for device types 01 and 05-cont.
Table 3. Group A inspection for device types 02 and 06
Table 3. Group A inspection for device types 02 and 06-cont.
Table 3. Group A inspection for device types 03
Table 3. Group A inspection for device types 03-cont.
Table 3. Group A inspection for device types 04
Table 3. Group A inspection for device types 04-cont.
Table 3. Group A inspection for device types 07
Table 3. Group A inspection for device types 07-cont.
Table 3. Group A inspection for device types 08
Table 3. Group A inspection for device types 08-cont.
Table 3. Group A inspection for device types 09
Table 3. Group A inspection for device types 09-cont.
Table 3. Group A inspection for device types 09-cont.
Table 3. Group A inspection for device types 09-cont.
Table 3. Group A inspection for device types 10
Table 3. Group A inspection for device types 10-cont.
Table 3. Group A inspection for device types 10-cont.
Table 3. Group A inspection for device types 10-cont.
Table 3. Group A inspection for device types 11
Table 3. Group A inspection for device types 11-cont.
Table 3. Group A inspection for device types 11-cont.
Table 3. Group A inspection for device types 11-cont.
Table 3. Group A inspection for device types 12
Table 3. Group A inspection for device types 12-cont.
Table 3. Group A inspection for device types 12-cont.
Table 3. Group A inspection for device types 12-cont.
Table 3. Group A inspection for device types 13
Table 3. Group A inspection for device types 13-cont.
Table 3. Group A inspection for device types 14
Table 3. Group A inspection for device types 14-cont.
Table 3. Group A inspection for device types 14-cont.
Table 3. Group A inspection for device types 14-cont.
Table 3. Group A inspection for device types 15
Table 3. Group A inspection for device types 16
Table 3. Group A inspection for device types 16-cont.
Table 3. Group A inspection for device types 16-cont.
The functional tests
Packaging requirements
Abbreviations, symbols, and definitions.
Timing parameter abbreviations.
Change from previous issue.

Microcircuits, Digital, Schottky TTL, 1024 BIT Random Access Memory (RAM), Monolithic Silicon

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